These are presentations from the INEMI Board Assembly & Test Technology Workshop (August 25-26, 2014).

Workshop Overview
Haley Fu, INEMI

INEMI Roadmap on Board Assembly & Test
Bill Bader, INEMI

Telecom Products Manufacturing Challenge Driven by Components
Xiaodong Jiang, Alcatel-Lucent

Assembly Technology Challenges for Server Systems
Wayne Zhang, IBM

3D Packaging Solutions with Flip Chip and Fan-out Wafer Level Technology Driving Performance and Cost Innovation
Ming-Che Hsieh, STATS ChipPAC

High Reliability Solder Alloy Solutions
Forrest Lin, Henkel

Effect of Sn Grain Morphology on Reliability of Lead Free Solder Joints in Thermal Cycling Tests
Babak Arfaei, Universal Instruments

System Reliability Design & Validation
Jason Jiang, Lenovo

Automotive Electronics Modules Assembly & Testing -- Complexity & Cost Challenges
Ravi Phadke, Delphi

High Density Interconnect Necessitates Board Test Innovation
N. K. Chari, Keysight Technologies (Agilent)

Board Test Automation, Productivity and Economics
Jacky Wang, Teradyne

Development of Low Temp Drop Shock Resistant Allow for Hand Held Devices
Andy Yuen, Alpha (Alent)

The Impact of Component Warping to Assembly Process Resulting to Head in Pillow and Non Wet Open Defects
Ranilo Aranda, Flextronics

Dispensing Methods and Requirements for Manufacturing of Mobile and Wearable Electronics
Mani Ahmadi, Nordson AT Electronic Systems

Group Discussion Outputs
Breakout groups